Processing required prior to plating


Electroloytic Hard Gold

• ¼ inch required for connection.
• No solder or tin residue.
• No overdeveloped resist.
• Double check for resist breakdown.

Electroloytic Soft Gold

• ¼ inch required for connection.
• No solder or tin residue.
• No overdeveloped resist.
• Double check for resist breakdown.
• > 80 micro-inches of Gold, use 3 mil resist.
• Use resist especially for Gold
• No finger prints or scratches
• No pits or nicks
• No step plating

Electroloytic Nickel Plating

• Make sure that boards are not undeveloped
• Use resist especially for Gold.
• No resist breakdown in non-plated through holes
• No finger prints or scratches
• No pits or nicks, step plating
• Check for connections

ENIG

• No solder or tin residue.
• No plugged holes
• Do not use scrubber prior to plating (Could leave residue).
• Eliminate boarders as much as possible.
• Through rinse and solder strip.
• No under or over etch.

Selective Gold(ENIG)

• Use only approved resist for ENIG
• Via holes should be plugged on both sides.
• Do not under or over develop
• Use resist especially for Gold.
• No resist breakdown in non-plated through holes
• No finger prints or scratches
• No pits or nicks
• No step plating

Nickel Palladium Gold – ENIPIG

• 24-Hour notice required.
• No resist or taping allowed.
• Do not over or under etch.
• No defects on the surface.
• Via holes should be plugged on both sides

White Tin

• Clean board
• Legend complete.
• Send panels in slip sheets.
• No finger prints or scratches
• Do not over or under develop
• Re-work must be done before white tin.
• No plugged holes

Silver

• Clean boards
• Legend complete.
• Send panels in slip sheets.
• No finger prints or scratches
• Do not over or under develop
• Re-work must be done before silver.
• No plugged holes

OSP

• Clean boards
• Legend complete.
• Send panels in slip sheets.
• No finger prints or scratches
• Do not over or under develop
• Re-work must be done before OSP.
• No plugged holes