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Plating Finishes

EFT Final Finish Services

ELECTROLYTIC NICKEL/GOLD (HARD GOLD – 99.7% min)
per Mil-G-45204 / ASTM B488:
Thickness requirements
Ni 100 micro-inches
Au 3-80 micro-inches

ELECTROLYTIC NICKEL/GOLD (SOFT GOLD – 99.9% min.)
per Mil-G-45204 / ASTM B488:
Thickness requirements
Ni Minimum100 micro-inches
Au 3-55 micro-inches

ELECTROLYTIC NICKEL (only) per AMS 2424E:
Thickness requirements
Ni 100 to 1000 micro-inches

ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) per IPC 4552:
Thickness requirements
Ellec. Ni 118 to 236 micro-inches
Au 2-5 micro-inches

ELECTROLESS NICKEL / PALLADIUM / GOLD:
Thickness requirements
Ni 118to 236 micro-inches
Pd 4-18 micro-inches
Au 1-2 micro-inches

IMMERSION WHITE TIN (Omikron™)
Thickness requirements
Sn 30 to 50 micro-inches

ORGANIC SOLDERABILITY PERSERVATIVE –OSP (Entek 106A)

IMMERSION SILVER:
Thickness requirements
Ag 6 to 18 micro-inches