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EFT Final Finish Services
ELECTROLYTIC NICKEL/GOLD (HARD GOLD – 99.7% min) per Mil-G-45204 / ASTM B488: Thickness requirements Ni 100 micro-inches Au 3-80 micro-inches
ELECTROLYTIC NICKEL/GOLD (SOFT GOLD – 99.9% min.) per Mil-G-45204 / ASTM B488: Thickness requirements Ni Minimum100 micro-inches Au 3-55 micro-inches
ELECTROLYTIC NICKEL (only) per AMS 2424E: Thickness requirements Ni 100 to 1000 micro-inches
ELECTROLESS NICKEL/IMMERSION GOLD (ENIG) per IPC 4552: Thickness requirements Ellec. Ni 118 to 236 micro-inches Au 2-5 micro-inches
ELECTROLESS NICKEL / PALLADIUM / GOLD: Thickness requirements Ni 118to 236 micro-inches Pd 4-18 micro-inches Au 1-2 micro-inches
IMMERSION WHITE TIN (Omikron™) Thickness requirements Sn 30 to 50 micro-inches
ORGANIC SOLDERABILITY PERSERVATIVE –OSP (Entek 106A)
IMMERSION SILVER: Thickness requirements Ag 6 to 18 micro-inches
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